The Summer Sequel You’ve Been Waiting For

Reading time ( words)

I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2.

This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.

Written by Ventec International Group’s Didier Mauve, Head of Global OEM and Technology, and Robert Art, Global Account Manager IMS/TIM, this book also addresses the key challenge of how to improve reliability of components as they become increasingly smaller and more efficient.

Peer reviewer Jan Pedersen, Director of Technology at NCAB Group, says, “IMS materials have been in the marketplace for decades now without a standard for the user’s reference. This textbook is an important contribution to the understanding of IMS materials and, specifically, the focus on total thermal resistance and the new IPC Test Method TM-650 2.3.54.”

Readers will learn the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values ​​of thermal conductivity when applied to the same material; the effects of measurement errors and tolerance in dielectric thickness can also vary.

Download your free copy today at I-007eBooks.com/tm2. You can also view our full library at I-007eBooks.com.

Dedicated to educating PCB designers, The Printed Circuit Designer’s Guide to… series of books is a valuable resource for people seeking the most relevant information available.

Look for other exciting titles in this series, like:

  • Stackups: The Design within the Design
  • High Performance Materials
  • System Analysis: Electromagnetic Interference and Thermal Analysis of Electronic Systems
  • …and more coming this summer

We hope you enjoy The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrate, Volume 2.

For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-7)

Share


Suggested Items

06/15/2022 | Pete Starkey, I-Connect007

The British Motor Museum in Warwickshire, housing the world’s largest collection of historic British cars, was venue for the 2022 Annual Symposium of the Institute of Circuit Technology on June 8, which attracted a substantial gathering of manufacturers and suppliers from the UK printed circuit industry. ICT chair Emma Hudson reflected upon lessons learned during the pandemic lock-down and how the industry has successfully adapted to circumstances. She commented that the UK’s PCB fabricators are extremely busy, as she introduced an outstanding conference program including a keynote from the incomparable Happy Holden.

06/10/2022 | Nolan Johnson, I-Connect007

PCB fabrication is back in the news this week and posting high readership numbers as well. Among the most-read news, we see industry leaders changing roles, capital equipment shipment milestones, operational cost efficiencies, and, last but not least, cybersecurity.

06/03/2022 | Andy Shaughnessy, Design007 Magazine

Things are heating up in the world of PCB design and manufacturing as well. In the past week, we published quite a bit of news—some good, some not so good. Some of the news is mixed, as we see with the EMS industry shipments rising YOY in April, but falling from the previous month. It’s nice to see NASA investing in American small businesses, but they didn’t really have a choice, did they?

Leave a Reply

Your email address will not be published.